DEEPX at MWC 2024: Advances Ultra-Low-Power On-Device AI Chip for Commercializing Generative AI

In This Article:

- DEEPX, a pioneer in AI chip technology, is forging ahead in the development of next-generation products capable of real-time processing for generative AI and Large Language Models (LLMs), aiming to revolutionize on-device AI through ultra-low-power AI chips by 2025.
- The company's technological prowess was unveiled early this year on the global stage at CES 2024, where DEEPX's revolutionary core technology earned three prestigious CES Innovation Awards and led to collaborations with over 70 global companies.
- Building on the momentum from CES 2024, DEEPX announced its strategic vision at MWC 2024, presenting a blueprint for the future of on-device AI and expand collaborations with global companies.

BARCELONA, Spain, Feb. 8, 2024 /PRNewswire/ -- DEEPX (CEO Lokwon, Kim), a frontrunner in AI chip technology, defines the critical technology for commercializing generative AI as the 'Federated Operation of LLM' and is advancing in its technology development. DEEPX is set to revolutionize on-device AI with its cutting-edge ultra-low-power AI chips and making a significant presence at the Mobile World Congress (MWC) 2024, held from February 26 to 29, where it will unveil a comprehensive blueprint for on-device AI and plans to expand partnerships with global collaborators. Currently, DEEPX is forging alliances with domestic and European telecommunications companies and global data center corporations, pushing for compatibility and optimization across network and cloud systems.

DEEPX at MWC 2024: Advances Ultra-Low-Power On-Device AI Chip for Commercializing Generative AI
DEEPX at MWC 2024: Advances Ultra-Low-Power On-Device AI Chip for Commercializing Generative AI

Experience the future of on-device AI at DEEPX's MWC 2024 booth at Hall 7, 7A62-19 

Prior to MWC 2024, DEEPX achieved a significant milestone at CES by unveiling its first-generation on-device AI chip technology. This accomplishment earned the company three CES Innovation Awards, solidifying its position as a global leader in comprehensive AI chip technology and attracted over 5,000 visitors to its booth. This achievement doubled the customer count of DEEPX's Early Engagement Customer Program (EECP) to 70 global companies, demonstrating the growing industrial demand for DEEPX's on-device AI solutions.

DEEPX's technological journey also includes the development of groundbreaking technology that enables the federated operation of server-scale AI and on-device large AI models. The company is planning to launch on-device AI chips capable of operating at just a few watts while delivering server-scale AI intelligence in personal devices by the second half of next year. This initiative stems from the recognition that on-device AI is the fundamental solution for widespread adoption of not only small AI models but also super-scale AIs like LLMs and generative AI.