System on Panel technology enables less material, lower energy consumption and more efficient electronic paper label solution

BILLERICA, Mass., April 15, 2024--(BUSINESS WIRE)--E Ink (8069.TW) the originator, pioneer, and global commercial leader in ePaper technology, today announced it is collaborating with ecosystem partners Realtek Semiconductor (Realtek), Integrated Solutions Technology (IST), and Chipbond Technology Corporation (Chipbond) to develop the System on Panel (SoP) architecture. This technology will be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator, SOLUM. In order to simplify the material structure of ESL, this collaboration aims to bring a sustainable solution via reduced material usage, lower power consumption and simplified production processes.

Realtek will supply low-power Bluetooth System on Chip (SoC) technology, while E Ink provides technical expertise and knowledge of ePaper displays and embedding integrated circuits (IC) directly onto glass and flexible substrates. The latest IC technology developed in collaboration with IST and Chipbond utilizes a new Conical Granule Au bump (CGA bump) to replace traditional gold bumps in the packaging process. This significantly reduces the amount of gold material necessary in IC packaging and testing, providing reliable, stable and competitively priced products. Global ESL system integrator, SOLUM, will also join in the development of the next generation ESL solution. The aim is to introduce thinner, lighter, and more energy-efficient ESLs into the retail market as soon as possible.

"Replacing paper labels with ePaper shelf labels brings higher efficiency and lower energy consumption to retailers," said Johnson Lee, CEO of E Ink. "Our commitment to advancing ePaper technology drives us to continue collaborations with our supply chain partners. We worked together to develop technology to realize the potential of SoP on ePaper panels and to drive the next generation electronic shelf label. The newly developed ePaper label solution will bring higher operational efficiency to retailers and contribute positively to carbon reduction efforts."

The SoP technology integrates IC, panel, and system production together, reducing processes, materials, and product volume, and lowering energy consumption. It establishes the system directly on the glass or flexible substrate, eliminating the need for additional printed circuit boards (PCBs). Major goals for the collaboration focus on overcoming challenges related to IC bonding, reducing line resistance, integrating antennas, and utilizing Anisotropic Conductive Film (ACF) processes.