ROHM’s New TRCDRIVE pack? with 2-in-1 SiC Molded Module: Significantly Reduces the Size of Electric Vehicle Inverters

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Achieves industry-leading power density by integrating 4th generation SiC MOSFETs in a compact package

ROHM’s New TRCDRIVE pack? with 2-in-1 SiC Molded Module

Industry-leading power density, ideal for xEV traction inverters
Industry-leading power density, ideal for xEV traction inverters

TRCDrive pack Features & Comparison vs. Standard SiC Modules

Class-leading power density contributes significantly to xEV inverter miniaturization
Class-leading power density contributes significantly to xEV inverter miniaturization

Santa Clara, CA and Kyoto, Japan, June 11, 2024 (GLOBE NEWSWIRE) -- ROHM Semiconductor today introduced four new models as part of the TRCDRIVE pack? series with 2-in-1 SiC molded modules (two 750V-rated, BSTxxxD08P4A1x4; two 1200V-rated,  BSTxxxD12P4A1x1) optimized for electric vehicle (xEV) traction inverters. TRCDRIVE pack? supports up to 300kW and features high power density and a unique terminal configuration, helping solve the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours.

As the electrification of cars rapidly advances towards achieving a decarbonized society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently progressing. However, for SiC power devices that are attracting attention as key components, achieving low loss in a small size has been a difficult challenge. ROHM solves these issues inside powertrains with its TRCDRIVE pack.

A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack reduces size by utilizing a unique structure that maximizes heat dissipation area. In addition, ROHM’s 4th generation SiC MOSFETs with low ON resistance are built in, resulting in an industry-leading[1] power density 1.5 times higher than that of general SiC molded modules, while greatly contributing to the miniaturization of xEV inverters.

The modules are also equipped with control signal terminals using press-fit pins, enabling easy connection by simply pushing the gate driver board from the top, considerably reducing installation time. In addition, low inductance (5.7nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching.

Despite developing modules, ROHM has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules.

Product Lineup
TRCDRIVE pack is scheduled to be launched by March 2025 with a lineup of 12 models in different package sizes (small / large) and mounting patterns (TIM: heat dissipation sheet / Ag sinter). In addition, ROHM is developing a 6-in-1 product with built-in heat sink that is expected to facilitate rapid traction inverter design and model rollout tailored to a variety of design specifications.