Tong Hsing Electronic Industries, Ltd. develops and produces thick film substrates and customized semiconductor micro-module packaging products. The company provides direct plated and bonded copper, active metal brazing, and thick film printed circuit substrate products; CMOS imaging products comprising wafer probing testing, wafer reconstruction, packaging, and image testing; and module packaging products, such as high frequency wireless communication modules and power semiconductors. It offers customized module packaging and testing products, including hybrid integrated circuit modules and biomedical products; and packaging services and substrate manufacturing technologies. In addition, the company provides wafer probing, backgrinding, wafer reconstruction, assembly, automated inspection, and finished module testing services for image sensor, MEMS and biomedical inspection products. Its products are used in automotive, aerospace, handset, wireless communication, MEMS, image sensor, optoelectronic semiconductor components, LED, solar cells, and medical electronics, and networking equipment. The company was incorporated in 1974 and is headquartered in New Taipei City, Taiwan.